This track covers analog and optical technologies, from chiplets and smart die-to-die interconnects to high-performance, long-reach and optical links. Discover serial link transmitters, receivers, and Silicon Photonics. Learn about Marvell’s future investments in high bandwidth analog, optics, and storage pre-amp technologies. 

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This track features posters and presentations on the latest advancements for ensuring the reliability and performance of complex IP and SoCs (System-on-a-Chips). Explore cutting-edge methodologies, tools, and technologies that drive the design verification, emulation, and validation processes. Examine the benefits of co-emulation, validation techniques for product security testing, best practices of formal verification, and the use of generative AI to create assertions. 

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This track delves into critical innovations driving our industry forward. Explore how cutting-edge advancements in chip architecture and algorithm optimization ensure our products not only meet but exceed market demands. 

Join us to uncover the breakthroughs that will shape the future of technology and secure our position at the forefront of innovation.

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These presentations will provide everyone at Marvell with a clear and concise understanding of the technologies and strategic initiatives driving our success. This is a great opportunity to grasp the end-to-end lifecycle of a Marvell product. 

On Day 2, experience the entire process of designing a computer chip (SoC – System on Chip), from inception through fabrication to production. Dive into the role of an architect, logic designer, analog layout engineer, package designer, physical designer, and many more roles at Marvell. Virtually visit some of our labs and test facilities to see the products in action. 

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The synergy between hardware and software is what sets us apart and drives our success.

Throughout this track, you’ll discover how our software and firmware teams are pushing boundaries, creating solutions that are robust, secure, and scalable. You’ll learn about the latest advancements, best practices, and innovative approaches in AI, Security and programming languages such as RUST.

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These presentations and posters will focus on design automation (EDA), post-silicon validation and operations. Join us to get a view of how we are making the most of our tools to prepare for the future.   Learn about the design automation space, with a focus on the company’s M1DP design flow, the use of AI within the company to solve a variety of problems, and yield modeling, fuzzing techniques, and lessons learned from large hyper-scaler engagements.  

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The world of Advanced Packaging has many exciting technological advancements.  Presentations will focus on novel 2.5D and 3D package architectures and delve into electrical advancements in high-speed packaging.  Additionally, discover new thermal solutions essential for dissipating heat from high-power designs.

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These presentations will provide everyone at Marvell with a clear and concise understanding of the technologies and strategic initiatives driving our success. This is a great opportunity to grasp the end-to-end lifecycle of a Marvell product. 

On Day 3, learn about Marvell’s product lines, their key advantages, how they are used and by what customers. Hear a discussion on key financial terms, Marvell’s approach to sustainability, some of our key value-add IP, and perspectives on the Marvell OS. 

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